Synthesis,characterization and catalytic activity of Fe(III) complexes containing Schiff base and triphenylphosphine ligands

The oxidation of alcohols to carbonyls was investigated by an efficient catalyst system comprising of Fe(III)–Schiff base–triphenylphosphine complex. The complex chloroN-(2-mercaptophenyl)salicylideneiminebis(triphenylphosphine)iron(III) showed higher activity for oxidation of various alcohols under relatively mild conditions.     

Synchrophasor communication

Synchronized phasor measurements provide the basis for fine-grained wide area power quality monitoring in electric grids. Time-synchronized phasor measurement units (PMUs) are deployed at different locations in the grid and report 10–60 measurements/second to energy management systems or other applications. For control applications it is crucial to receive measurement data as soon as possible after a state change in order to trigger corrective actions in time to prevent incidents in the grid. In this paper we analyze characteristics of synchrophasor M2M communication for different network technologies, including VDSL, HSPA and LTE networks. We briefly review synchrophasor communication approaches and real-time demands. We then emulate PMU traffic and perform measurements on different networks. We show how the underlying technology influences one-way delay patterns for synchrophasor communication, which has direct implication on the achievable real-time properties.     

Studies on the Cell Structure and Mechanical Properties of NR/Latex Reclaim/HSR Based Micrqcellular Sheets

In natural rubber/high styrene resin microcellular sheets, part of natural rubber was replaced by latex reclaim prepared from waste latex products. The mechanical properties and cell structure of the products were evaluated. It was found that latex reclaim can replace about 30% of natural rubber without affecting the technical properties of the microcellular sheets.     

REACTIVE EXTRACTION OF LEVULINIC ACID FROM AQUEOUS SOLUTIONS WITH TRI-n-OCTYLAMINE (TOA) IN 1-OCTANOL: EQUILIBRIA,KINETICS, AND MODEL DEVELOPMENT

Levulinic acid, a carboxylic acid containing a ketone structure, can be used as an acidulant in foods and beverages. Reactive extraction is a promising alternative for the recovery of carboxylic acids from aqueous streams. The design of an amine extraction process requires kinetic data for the acid-amine + solvent system used. In this study, equilibrium and kinetic data on the extraction of levulinic acid from aqueous solutions using tri-n-octylamine (TOA) in 1-octanol have been determined. The mass transfer coefficients of levulinic acid, TOA, and 2:1 levulinic acid-amine complex in 1-octanol were calculated from the acetic acid mass transfer coefficient, which was determined by measuring its fluxes of simple diffusion from kerosene to water. Based on the Hatta number and the criterion given by Doraiswamy and Sharma, the reaction regime has been found to be instantaneous reaction regime occurring at the interface on the organic phase side. An extraction model comprising equilibrium complexation constant w.r.t 2:1 levulinic acid-TOA complex formation, K_E2i (14.794 (m³ kmol^?1)²), and complex mass transfer coefficient, k_B2A (2.193 × 10^?6 m s^?1), has been developed.     

Electrodeposition and properties of nanocrystalline ZnO films prepared in the presence of anionic surfactant SDS and ionic liquid 1-butyl-3-methylimidazolium methylsulfate

ZnO thin films were potentiostatically electrodeposited on transparent tin oxide conducting glass substrates at ?1.0 V (vs. Ag/AgCl) in the presence of anionic surfactant, sodium dodecyl sulphate (SDS) and hydrophobic ionic liquid, 1-butyl-3-methylimidazolium methylsulfate [bmim][CH₃SO₄]. X-ray diffraction (XRD) investigation confirm the formation of nanocrystalline and stoichiometric ZnO thin films. Scanning electron microscopy (SEM) results reveal that the grain size of the deposited ZnO film is reduced from 85 to 28 nm when small amount of ionic liquid is added to the deposition bath. Photoluminescence study at room temperature shows a clear absorption edge in the ultra violet (UV) region confirming the high quality, nanocrystalline and stoichiometric nature of the deposited ZnO films.     

Bi-objective optimization of the reliability-redundancy allocation problem for series-parallel system

The main objective of this paper is to solve the bi-objective reliability redundancy allocation problem for series-parallel system where reliability of the system and the corresponding designing cost are considered as two different objectives. In their formulation, reliability of each component is considered as a triangular fuzzy number. In order to solve the problem, developed fuzzy model is converted to a crisp model by using expected values of fuzzy numbers and taking into account the preference of decision maker regarding cost and reliability goals. Finally the obtained crisp optimization problem has been solved with particle swarm optimization (PSO) and compared their results with genetic algorithm (GA). Examples are shown to illustrate the method. Finally statistical simulation has been performed for supremacy the approach.     

A numerical study of particle wall-deposition in a turbulent square duct flow

The deposition of dense solid particles in a downward, fully developed turbulent square duct flow at Re_τ = 360, based on the mean friction velocity and the duct width, is studied using large eddy simulations of the fluid flow. The fluid and the particulate phases are treated using Eulerian and Lagrangian approaches, respectively. A finite-volume based, second-order accurate fractional step scheme is used to integrate the incompressible form of the unsteady, three-dimensional, filtered Navier-Stokes equations on an 80 × 80 × 128 grid. A dynamic subgrid kinetic energy model is used to account for the unresolved scales. The Lagrangian particle equation of motion includes the drag, lift, and gravity forces and is integrated using the fourth-order accurate Runge-Kutta scheme. Two values of particle to fluid density ratio (ρ_p/ρ_f = 1000 and 8900) and five values of dimensionless particle diameter (d_p/δ × 10⁶ = 100, 250, 500, 1000 and 2000, δ is the duct width) are studied. Two particle number densities, consisting of 10⁵ and 1.5 × 10⁶ particles initially in the domain, are examined.Variations in the probability distribution function (PDF) of the particle deposition location with dimensionless particle response time, i.e. Stokes number, are presented. The deposition is seen to occur with greater probability near the center of the duct walls, than at the corners. The average streamwise and wall-normal deposition velocities of the particles increase with Stokes number, with their maxima occurring near the center of the duct wall. The computed deposition rates are compared to previously reported results for a circular pipe flow. It is observed that the deposition rates in a square duct are greater than those in a pipe flow, especially for the low Stokes number particles. Also, wall-deposition of the low Stokes number particles increases significantly by including the subgrid velocity fluctuations in computing the fluid forces on the particles. Two-way coupling and, to a greater extent, four-way coupling are seen to increase the deposition rates.     

Evaluation of Bulk Mechanical Properties of Selected Lead-Free Solders in Tension and in Shear

Lead-free solders are fast emerging as better alternatives to Sn-Pb solders. The reliability of a soldered joint to withstand imposed stresses in an assembly is decided by its mechanical properties. The present work is about the investigation of tensile and shear properties of four binary eutectic alloys Sn-3.5Ag, Sn-58Bi, Sn-0.7Cu, Sn-9Zn and a ternary alloy Sn-57Bi-1.3Zn in comparison with conventional Sn-38Pb alloy. It is observed that the lead-free solders have better mechanical properties than the latter. SEM studies of tensile and shear fracture show ductile dimples circular in tension and parabolic in shear modes supporting the mechanical behavior of the alloys investigated. Eutectic alloys Sn-Ag, Sn-Zn, and Sn-Cu form potential substitutes for Sn-Pb for electronic interconnects exposed to high temperatures, while Sn-Bi and Sn-Bi-Zn are attractive alternatives in addressing the need of lower processing temperatures in printed circuit boards and other applications.